Bga Package Types

AND8075/D Board Mounting Considerations For FCBGA Packages
Package Interconnects There are many BGA package types, but the die for all types is connected to the package substrate by the wirebond method (Figure 1), or by the flip–chip direct attachment method (Figure 2). The CSP, PBGA, and FCBGA are the most common BGA package types. A Chip Scale Package (CSP) can have either wirebond or flip–chip die ... Read Content

BGA/CSP Re-balling Bob Doetzer Circuit Technology Inc. Www ...
Common” Ball Grid Array Packages (see figure 1) Plastic Ball Grid Arrays (PBGA) – Figure 2. The PBGA is the most common of the BGA package types. It uses an overmolded resin substrate to encapsulate the die/chip and either SN63/PB37 eutectic solder bumps or SN62/PB36/AG2 solder bumps are used for attachment to the mounting site. See figure ... Doc Retrieval

Package Information Datasheet For Altera Devices
Ball-Grid Array (BGA) Ceramic Pin-Grid Array (PGA) FineLine BGA (FBGA) Hybrid FineLine BGA (HBGA) Plastic Dual In-Line Package (PDIP) ... Read Document

Technology Readiness Overview: Ball Grid Array And Chip Scale ...
BGA Types Examples of typical BGA packages are shown in Figure 2. These include plastic ball grid array with ball composition of eutectic 63Sn/37Pb alloy or slight variation. The ceramic BGA package uses a higher melting ball (90Pb/10Sn) with eutectic attachment to the die and board. Column ... Document Viewer

Field-programmable Gate Array - Wikipedia
A field-programmable gate array (FPGA) is an integrated circuit designed to be configured by a customer or a designer after manufacturing – hence the term "field-programmable".The FPGA configuration is generally specified using a hardware description language (HDL), similar to that used for an application-specific integrated circuit (ASIC). ... Read Article

Land Grid Array (LGA) Package Rework
For the Land Grid Array (LGA) style package. Freescale has introduced radio frequency (RF) modules such as the MC1320x and MC1321x in LGA packages as an alternative package to ball grid array (BGA). The LGA packages reduce the amounts of lead in finished products and are Reduction of Hazardous Substances (RoHS) compliant, optimized for improved ... Retrieve Doc

How To Remove And Install IC On Cellphone - YouTube
Im back again, heres my simple demonstration on how to remove and install an IC of a Cellphone. Visit my Site at http://hubpages.com/profile/geraldgarces. ... View Video

Board Level Reliability Comparison Of BGA And LGA Packages ...
The BGA package (Figure 2) had the same pitch and matrix, but used 0.35mm dia. SAC balls for I/O soldering connections. Figure 1. LGA Package. Figure 2. BGA Package. Test Board . The test board (Figure 3) was a 132x77x1mm, 8 layer FR-4 JEDEC design with Cu OSP finish that included 3x5 matrix of the LGA package (footprint) land pad design having ... Retrieve Full Source

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